Laser dicing

  • BusinessLaser dicing

    Advantages and Challenges of Laser Dicing

    Laser dicing is a cutting process that uses a highly concentrated laser instead of blades. It removes material from a wafer by directing the beam at the wafer’s surface and cutting along a scribed pattern. This process also uses water to cool the substrate to prevent thermal damage and particle contamination. This process is becoming increasingly popular in semiconductor manufacturing.…

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